Adjustable cooling unit for semiconductor module

ABSTRACT

A cooling unit for a semiconductor module includes a plate shaped first cooling body, a plate shaped second cooling body opposing the first cooling body and an adjustable cooling member placed between the first and second cooling bodies so that a distance between the first and second cooling bodies may be adjusted. Shapes of the cooling body include a honeycomb structure, cylinders, a hemicylindrical shape, a zigzag shape, and a bellows structure shape. By forming the cooling unit with an adjustable cooling member, the cooling unit can fit electronic devices of various sizes.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority to Korean patent applicationnumber 10-2007-91693 filed on Sep. 10, 2007, which is incorporatedherein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a cooling unit for a semiconductormodule, and more particularly to a cooling unit for a semiconductormodule that is universally applicable to various kinds of electronicappliances.

Recently, a semiconductor package equipped with a high performancesemiconductor device has been developed along with the development oftechnology for fabricating the semiconductor device. A semiconductorpackage is applied to most electronic appliances as the size ofelectronic appliances has become smaller. Performance of the smallerelectronic devices has been enhanced due to the development of thesemiconductor package equipped with the semiconductor device.

Additionally, as the performance of the semiconductor device has beenenhanced, the semiconductor device has become able to store massive dataand process the massive data in a short time.

However, the semiconductor device generates large amounts of heat whileprocessing data, and the generated heat reduces the performance of thesemiconductor device.

In order to rapidly radiate the heat generated from the semiconductorpackage including the semiconductor device, a semiconductor packageequipped with a cooling unit for radiating heat generated from thesemiconductor device has been developed.

However, when applying a conventional semiconductor package equippedwith a cooling unit to various electronic appliances, there is adisadvantage in that the size of the cooling unit makes it difficult toapply the semiconductor package equipped with the cooling unit tocertain electronic appliances.

BRIEF SUMMARY OF THE INVENTION

Embodiments of the present invention are directed to a cooling unit fora semiconductor module, which is universally applicable to various kindsof electronic appliances.

In one embodiment, a cooling unit for a semiconductor module maycomprise a plate shaped first cooling body; a plate shaped secondcooling body opposing the first cooling body; and a cooling memberplaced between the first and second cooling bodies that is adjustable involume so that a distance between the first and second cooling bodiesmay be adjusted.

At least one of the first and second cooling members may include ametal.

The cooling member may have various different structures, one being ahoneycomb structure having hexagonal sections.

The cooling member with a honeycomb structure includes a first coolingmember formed a plurality of first adhesive parts having a first widthand a plurality of first volume adjusting parts having a second width,the two of which are connected to each other and alternate.; a secondcooling member having a plurality of second adhesive parts correspondingto the first adhesive parts and a plurality of second volume adjustingparts corresponding to the first volume adjusting parts; and an adhesivemember is placed between the first and the second adhesive parts thatcontact each other.

At least two cooling members having the honeycomb structure may beplaced such that they interconnect with each other.

In the honeycomb structure, the width of the first adhesive parts (thefirst width) may be narrower than the width of the volume adjustingparts (the second width).

Alternatively, the cooling member may have a hemicylindrical shape (forexample the shape of a leaf spring) in which a curved face thereof is incontact with an inner face of the first cooling body and both endsthereof are in contact with an inner face of the second cooling body.

The cooling member with the hemicylindrical shape may have rumples forincreasing a contact area between the cooling member and the firstcooling body.

The cooling member may also have a zigzag shape.

The cooling member with the zigzag shape may also have rumples forincreasing contact areas between the zigzag shape and the first andsecond cooling bodies.

Finally, the cooling member may also have a bellows shape.

In the cooling units described above, in order to couple the firstcooling body to the second cooling body, the first cooling body includesa coupling protrusion that protrudes from side face of the first coolingbody and extends toward the second cooling body. The second cooling bodyincludes a coupling recess in which the coupling protrusion is inserted.

In order to connect the cooling unit to a semiconductor module, thecooling unit includes a protrusion part which protrudes from a side faceof the first cooling body and the protrusion part has a through hole.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a first embodiment of thepresent invention.

FIG. 2 is a cross-sectional view of the cooling unit shown in FIG. 1.

FIG. 3 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a second embodiment of thepresent invention.

FIG. 4 is a cross-sectional view of the cooling unit shown in FIG. 3.

FIG. 5 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a third embodiment of thepresent invention.

FIG. 6 is a cross-sectional view of the cooling unit shown in FIG. 5.

FIG. 7 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a fourth embodiment of thepresent invention.

FIG. 8 is a cross-sectional view of the cooling unit shown in FIG. 7.

FIG. 9 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a fifth embodiment of thepresent invention.

FIG. 10 is a cross-sectional view of the cooling unit shown in FIG. 9.

DESCRIPTION OF SPECIFIC EMBODIMENTS

A preferred embodiment of the present invention is directed to a coolingunit for a semiconductor module which includes a plate shaped firstcooling body, a plate shaped second cooling body opposing to the firstcooling body and a cooling member placed between the first and secondcooling bodies that is adjustable in volume so as to adjust a distancebetween the first and second cooling bodies.

FIG. 1 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a first embodiment of thepresent invention. FIG. 2 is a cross-sectional view of the cooling unitshown in FIG. 1.

Referring to FIGS. 1 and 2, the cooling unit 100, which can be appliedto a semiconductor module, includes a first cooling body 110, a secondcooling body 120 and a cooling member 130 that is adjustable in volume.

The first cooling body 110 has, for example, a plate shape. Morespecifically, the first cooling body 110 has, for example, the shape ofa rectangular parallelepiped plate.

In the present embodiment, the rectangular parallelepiped first coolingbody 110 includes a first face 111, a second face 112 that opposes thefirst face 111, and four side faces 113, 114, 115, 116.

Examples of material that may be used as the first cooling body 110include aluminum, aluminum alloy, copper, copper alloy, and metal ally,etc. Alternatively, carbon compound or synthetic resin, which hassimilar thermal conductivity to metal, may be used as the first coolingbody 110.

The second cooling body 120 opposes the first cooling body 110. Thesecond cooling body 120 has, for example, a plate shape. Morespecifically, the second cooling body 120 has, for example, the shape ofa rectangular parallelepiped plate. The second cooling body 120 hassubstantially the same shape and size as the first cooling body 110.

In the present embodiment, the rectangular parallelepiped second body120 includes a third face 121, a fourth face 122 that opposes the thirdface 121, and four side faces 123, 124, 125, 126.

Examples of material that may be used as the second cooling body 120include aluminum, aluminum alloy, copper, copper alloy, and metal ally,etc. Alternatively, carbon compound or synthetic resin, which hassimilar thermal conductivity to metal, may be used as the second coolingbody 120.

In the present embodiment, the first and second cooling bodies 110 and120 may include a metal having superior thermal conductivity.Alternatively, either of the first and second cooling bodies 110 and 120may include a typical metal.

In the present embodiment, in order to couple the first cooling body 110to the second cooling body 120, the first cooling body 110 is formedwith a coupling protrusion 113 a, and the second cooling body 120 isformed with a coupling recess 127. The coupling protrusion 113 a formedon the first cooling body 110 is protruded, for example, in a bar shapefrom side faces 113 of the first cooling body 110, and the couplingprotrusion 113 a protruded from the side faces 113 is bent toward thesecond cooling body 120. The side faces 123 and 125 of the secondcooling body 120 are formed with coupling recesses 127 to which therespective coupling protrusions 113 a are coupled.

Referring specifically to FIG. 2, the cooling member 130 rapidlyradiates heat transferred to the first cooling body 110 and/or thesecond cooling body 120 and adjusts a distance P between the firstcooling body 110 and the second cooling body 120. In order to realizethis, the cooling member 130 may have a honeycomb structure havinghexagonal sections for volume adjustment.

Specifically, the cooling member 130 having a honeycomb structureincludes a first cooling member 131, a second cooling member 132 and anadhesive member 133.

In the present embodiment, example of material that may be used as thefirst and second cooling members 131 and 132 include aluminum, aluminumalloy, copper, copper alloy, metal ally, etc. When looking at the thefirst and second cooling members 131 and 132 from the front, they mayhave, for example, the shape of a thin film having a small thickness.

When looking at the first cooling member 131 from the side, it has theshape of a rectangular sheet. Referring to FIG. 2, the first coolingmember 131 includes a first adhesive part 131 a having a first width L1and a first volume adjusting part 131 b having a second width L2. Thefirst adhesive part 131 a and the first volume adjusting part 131 b areformed alternately in the first cooling member 131.

When looking at the second cooling member 132 from the side, it has theshape of a rectangular sheet. Referring to FIG. 2, the second coolingmember 132 includes a second adhesive part 132 a having the first widthL1 and a second volume adjusting part 132 b having the second width L2.The second adhesive part 132 a and the second volume adjusting part 132b are formed alternately in the second cooling member 132.

In the present embodiment, the first adhesive part 131 a and the firstvolume adjusting part 131 b of the first cooling member 131 are formedat positions corresponding to the second adhesive part 132 a and thesecond volume adjusting part 132 b of the second cooling member 132.

In addition, in the present embodiment, the width L1 of the firstadhesive part 131 a may be smaller than the width L2 of the first volumeadjusting part 131 b.

The adhesive member 133 is placed between the first adhesive part 131 aof the first cooling member 131 and the corresponding second adhesivepart 132 a of the second cooling member 132, thereby adhering thecorresponding first cooling member 131 and second cooling member 132 toeach other.

In the present embodiment, the cooling member 130 having the first andsecond cooling members 131 and 132 is placed between the first andsecond cooling bodies 110 and 120. The thickness of the cooling member130 can be widened or narrowed by applying tension to sides of the firstand second cooling members 131 and 132.

Although a single cooling member 130 is placed between the first andsecond cooling bodies 110 and 120 in the present embodiment, a pluralityof cooling members 130 may be placed between the first and secondcooling bodies 110 and 120.

Referring back to FIG. 1, in order to couple the cooling unit 100 (whichincludes the first cooling body 110, the second cooling body 120 and thecooling member 130) to a semiconductor module (not shown), a protrusionpart 117 may be formed on the side faces 114 and 116 of the firstcooling body 110. The protrusion parts 117 protrude in a rectangularshape from the side faces 114 and 116 of the first cooling body 110. Theprotrusion part 117 is formed with a through hole 118. The protrusionpart 117 and a semiconductor module may be coupled to each other by arivet, screw, etc.

FIG. 3 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a second embodiment of thepresent invention. FIG. 4 is a cross-sectional view of the cooling unitshown in FIG. 3. The cooling unit in accordance with the secondembodiment of the present invention is substantially the same as that ofthe first embodiment of the present invention, which is described above,except for the cooling member. Therefore, the descriptions of theduplicate parts will be omitted, and the same names and referencesymbols will be given to the duplicate parts.

In the second embodiment, a cooling unit 100 includes a first coolingbody 110, a second cooling body 120 and a cooling member 140.

The cooling member 140 is placed between the first cooling body 110 andthe second cooling body 120.

The cooling member 140 has a plurality of cylinders 142. The pluralityof cylinders 142 are arranged in a row between the first cooling body110 and the second cooling body 120. The adjacent two cylinders of thecooling member 140 may be adhered to each other by an adhesive agent144. Examples of material usable as the cylinders 142 of the coolingmember 140 include aluminum, aluminum alloy, copper, copper alloy, metalally, etc., these materials having superior thermal conductivity.

In the cooling unit 100 of the present embodiment, a volume of thecooling member may be adjusted by applying compressive force to thecooling member 140 placed between the first and second cooling bodies110 and 120, which deforms the cylindrical cooling member 140 into anelliptical shape.

FIG. 5 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a third embodiment of thepresent invention. FIG. 6 is a cross-sectional view of the cooling unitshown in FIG. 5. The cooling unit in accordance with the thirdembodiment of the present invention is substantially the same as thefirst embodiment of the present invention, which is described above,except for the cooling member. Therefore, descriptions of the duplicateparts will be omitted, and the same names and reference symbols will begiven to the duplicate parts.

In the third embodiment a cooling unit 100 includes a first cooling body110, a second cooling body 120 and a cooling member 150.

The cooling member 150 is placed between the first cooling body 110 andthe second cooling body 120.

The cooling member 150 in accordance with the present embodiment has,for example, a shape of a leaf spring (or a hemicylindrical shape). Acircumferential face of the cooling member 150 is placed, for example,on the first cooling body 110 and a pair of ends of the cooling member150 is placed on the second cooling body 120. Examples of materialusable as the cooling member 150 include aluminum, aluminum alloy,copper, copper alloy, etc.

In the present embodiment, in order to increase the contact area betweenthe cooling member 150 and the first and second cooling bodies 110 and120, the cooling member 150 may be formed to be irregular or rumpled.

In the cooling unit 100 in accordance with the present embodiment, aninternal volume of the cooling member 150 can be adjusted by applyingcompressive force to the cooling member 150 placed between the first andsecond cooling bodies 110 and 120, such that the cooling member 150having a shape of a leaf spring becomes deformed.

FIG. 7 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a fourth embodiment of thepresent invention. FIG. 8 is a cross-sectional view of the cooling unitshown in FIG. 7. The cooling unit in accordance with the fourthembodiment of the present invention is substantially the same as thefirst embodiment of the present invention, which is described above,except for the cooling member. Therefore, descriptions of duplicateparts will be omitted and the same names and reference symbols will begiven to the duplicate parts.

In the third embodiment, a cooling unit 100 includes a first coolingbody 110, a second cooling body 120 and a cooling member 160.

The cooling member 160 is placed between the first cooling body 110 andthe second cooling body 120.

The cooling member 160 in accordance with the present embodiment has,for example, a zigzag shape. A first face of the zigzag shaped coolingmember 160 is placed, for example, on the first cooling body 110, and asecond face of the zigzag shaped cooling member 160 is placed on thesecond cooling body 120. Examples of material usable as the coolingmember 160 includes aluminum, aluminum alloy, copper, copper alloy, etc.

In the present embodiment, in order to increase the contact area betweenthe cooling member 160 and the first and second cooling bodies 110 and120, the cooling member 160 may be formed to be irregular or rumpled.

In the cooling unit 100 in accordance with the present embodiment, theinternal volume of the cooling member 160 can be adjusted by applyingcompressive force to the cooling member 160, which is placed between thefirst and second cooling bodies 110 and 120, to deform the zigzag shapedcooling member 160.

FIG. 9 is an exploded perspective view illustrating a cooling unit for asemiconductor module in accordance with a fifth embodiment of thepresent invention. FIG. 10 is a cross-sectional view of the cooling unitshown in FIG. 9. The cooling unit in accordance with the fifthembodiment of the present invention is substantially the same as thefirst embodiment of the present invention, which is described in above,except for the cooling member. Therefore, descriptions of duplicateparts will be omitted, and the same name and reference symbol will begiven to the duplicate parts.

In the fifth embodiment, a cooling unit 100 includes a first coolingbody 110, a second cooling body 120 and a cooling member 170.

The cooling member 170 is placed between the first cooling body 110 andthe second cooling body 120.

The cooling member 170 in accordance with the present embodiment has abellows structure and includes, for example, a pair of cooling faces 171and 172 which oppose each other, and bellows portions 173 connecting theedges of the cooling faces 171 and 172. The cooling face 171 of thecooling member 170is placed, for example, on the first cooling body 110and the cooling face 172 of the cooling member 170 is placed on thesecond cooling body 120. Examples of material usable as the coolingmember 160 include aluminum, aluminum alloy, copper, copper alloy, etc.

In the present embodiment, in order to increase the contact area betweenthe cooling member 170 and the first and second cooling bodies 110 and120, the cooling faces 171 and 172 may be formed to be irregular orrumpled.

In the cooling unit 100 in accordance with the present embodiment, avolume of the cooling member 170 can be adjusted by applying compressiveforce or tension to the bellows structure of the cooling member 170,which is placed between the first and second cooling bodies 110 and 120,such that the cooling member 170 becomes deformed.

The cooling unit in accordance with the present invention, which isdescribed above, may be coupled to, for example, a semiconductor moduleon which a plurality of semiconductor packages is mounted. When thecooling unit 100 is coupled to a semiconductor module, the heatgenerated from the semiconductor module can be rapidly radiated, and thesemiconductor module can be mounted to various different electronicappliances without there being a limit in the size of the cooling unit100 to be mounted on the semiconductor module.

Although specific embodiments of the present invention have beendescribed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and the spirit of theinvention as disclosed in the accompanying claims.

1. A cooling unit for a semiconductor module, comprising: a plate shapedfirst cooling body; a plate shaped second cooling body opposing thefirst cooling body; and a cooling member placed between the first andsecond cooling bodies, the cooling member being adjustable in volumesuch that a distance between the first and second cooling bodies areadjusted.
 2. The cooling unit for a semiconductor module according toclaim 1, wherein at least one of the first and second cooling membersincludes a metal.
 3. The cooling unit for a semiconductor moduleaccording to claim 1, wherein the cooling member has a honeycombstructure having a plurality of parallel parts and angled parts whichform hexagonal sections.
 4. The cooling unit for a semiconductor moduleaccording to claim 3, wherein the cooling member comprises: a firstcooling member having a plurality of first adhesive parts having a firstwidth and a plurality of first volume adjusting part having a secondwidth, wherein the first adhesive parts and the first volume adjustingparts are connected and alternate such that a first half of eachhexagonal section is formed; a second cooling member having a pluralityof second adhesive parts corresponding to the first adhesive parts and aplurality of second volume adjusting parts corresponding to the firstvolume adjusting parts, such that a second half of the hexagonalsections that are opposite to the first half are formed; and an adhesivemember placed between the first and the second adhesive parts whichcontact each other.
 5. The cooling unit for a semiconductor moduleaccording to claim 4, wherein a plurality of cooling members are placedin a manner such that the cooling members interconnect.
 6. The coolingunit for a semiconductor module according to claim 4, wherein the firstwidth is narrower than the second width.
 7. The cooling unit for asemiconductor module according to claim 1, wherein the cooling memberhas a plurality of cylinders.
 8. The cooling unit for a semiconductormodule according to claim 7, wherein the plurality of cylinders arearranged in a row between the first cooling body and the second coolingbody.
 9. The cooling unit for a semiconductor module according to claim1, wherein the cooling member has a hemicylindrical shape in which acurved face thereof is in contact with an inner face of the firstcooling body and both ends thereof are in contact with an inner face ofthe second cooling body.
 10. The cooling unit for a semiconductor moduleaccording to claim 9, wherein the cooling member has rumples forincreasing a contact area between the cooling member and the firstcooling body.
 11. The cooling unit for a semiconductor module accordingto claim 1, wherein the cooling member contains a plurality of facesforming a zigzag shape, wherein a first face contacts the first coolingbody, and a last face contacts the second cooling body.
 12. The coolingunit for a semiconductor module according to claim 11, wherein thecooling member has rumples to increase a contact area between the firstface and the first cooling body and the last face and the second coolingbody.
 13. The cooling unit for a semiconductor module according to claim1, wherein the cooling member has a bellows structure shape.
 14. Thecooling unit for a semiconductor module according to claim 1, furthercomprising: a coupling protrusion that protrudes from a side face of thefirst cooling body and extends toward the second cooling body, and acoupling recess formed in the second cooling body in which the couplingprotrusion is inserted.
 15. The cooling unit for a semiconductor moduleaccording to claim 1, further comprising: a protrusion part forconnecting the cooling unit to a semiconductor module, wherein theprotrusion part protrudes from a side face of the first cooling body andthe protrusion part has a through hole.